Qualcomm, a global designing and manufacturing company of semiconductors and wireless telecommunication products is inviting applications for its Interim Engineering Internship Program.
Job Area
Interim Engineering Intern – SW (Software)
Roles & Responsibilities
- Design, and develop Software for Qualcomm’s mobile chipsets which are based on cutting-edge technology.
- Development of real-time embedded software and device drivers
- Mobile SW development for Windows Mobile, Android, or Linux
- Wireless network standards such as CDMA/GSM/UMTS/LTE
- Linux/UNIX, Linux Drivers, Linux Kernel Development
- Protocols such as TCP/UDP/IP/SIP/RTP etc
- Multimedia technologies including Audio, Video codecs, Image Processing
- Wireless Modem Technologies, such as 4G, WiFi, Bluetooth, and Self-Organizing Networks.
- Platform Level SW, such as Linux, Android, Windows, and Board Support Packages.
- IOT Technologies, for Connected Cameras, Smart Assistants, Drones, Virtual Reality, Augmented Reality.
Interim Engineering Internship Program Include
- SW development for Android, and Windows Mobile Embedded Platforms
- Multimedia software stack, firmware, and driver Development
- Wireless Modem and connectivity Software and Firmware Development
- Communication protocol stack Software Development
- Kernel, BSP, and Device Driver Development
- Application SW and UI development
- SW Architecture for embedded devices based on Android, and Windows
- Design and development based on Object-oriented programming.
Eligibility Criteria
Education
Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE
Skills
- Good understanding of OS concepts, Data structures, etc
- Excellent analytical and problem-solving skills
- Ability to collaborate and work in teams
- Good verbal and written communication skills
Interim Engineering Intern
Interim Engineering Intern salary at Qualcomm would range between ₹ 3.6 Lakhs to ₹ 5.4 Lakhs.
Location
Hyderabad, Telangana
